Inspection form Template
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Tools Of The Trade – Inspection Tools Of The Trade – Inspection In the last episode, we put our circuit boards through the reflow process. Unfortunately, it’s not 100% accurate, and there are often problems that can occur that need to be detected and fixed. That’s what the inspection step is for. One could insert an inspection step after paste, after placement, and after reflow, but the first two are icing on the cake — the phase where most mistakes can be caught is after reflow. In the last episode, we put our circuit boards through the reflow process. Unfortunately, it’s not 100% accurate, and there are often problems that can occur that need to be detected and fixed. That’s what the inspection step is for. One could insert an inspection step after paste, after placement, and after reflow, but the first two are icing on the cake — the phase where most mistakes can be caught is after reflow. There are a number of problems typical with a surface mount reflow process: Tombstoning – This is when a component stands up vertically. This is bad because it means the component is not connected and there is an open circuit. Billboarding – This is when the component flips on its side. It’s still connected, so nothing is technically wrong here, but it’s not great and could indicate other problems with the process. Bridging – This is really bad. When too much solder (or bad solder mask) allows for two nearby pads to be accidentally bridged with solder, creating an unwanted connection. Insufficient Fill – If not enough solder paste is deposited in the screen, then it may not be enough to make a connection. This is more common with QFN parts that have super tiny apertures that could get clogged, and it’s really hard to see when inspecting. Voiding – Similar to insufficient fill, this is when there is not solder where there should be. This could be caused by flux that has turned to gas but hasn’t had a chance to escape, leading to holes inside the joint. Or if there is a via in a pad, the solder might wick into the via creating an empty space between the pad and the intended connection. Spattering – Imagine a small droplet of water inside the solder paste. As the water turns to steam, it explosively releases its pressure, throwing particles of solder all over. Flux can do this, too. Solder Balls – Too much solder paste is applied and ends up collecting on top of some solder mask. Because the solder doesn’t stick to solder mask and instead sticks to itself, it forms little balls on top of the PCB. These balls can move around and accidentally bridge connections. There are a number of problems typical with a surface mount reflow process: Tombstoning – This is when a component stands up vertically. This is bad because it means the component is not connected and there is an open circuit. Billboarding – This is when the component flips on its side. It’s still connected, so nothing is technically wrong here, but it’s not great and could indicate other problems with the process. Bridging – This is really bad. When too much solder (or bad solder mask) allows for two nearby pads to be accidentally bridged with solder, creating an unwanted connection. Insufficient Fill – If not enough solder paste is deposited in the screen, then it may not be enough to make a connection. This is more common with QFN parts that have super tiny apertures that could get clogged, and it’s really hard to see when inspecting. Voiding – Similar to insufficient fill, this is when there is not solder where there should be. This could be caused by flux that has turned to gas but hasn’t had a chance to escape, leading to holes inside the joint. Or if there is a via in a pad, the solder might wick into the via creating an empty space between the pad and the intended connection. Spattering – Imagine a small droplet of water inside the solder paste. As the water turns to steam, it explosively releases its pressure, throwing particles of solder all over. Flux can do this, too. Solder Balls – Too much solder paste is applied and ends up collecting on top of some solder mask. Because the solder doesn’t stick to solder mask and instead sticks to itself, it forms little balls on top of the PCB. These balls can move around and accidentally bridge connections. In the picture above are examples of tombstoning (C4), billboarding (R6), bridging (IC1), spattering (all over), solder balls (bottom right), and insufficient fill (IC2). In the picture above are examples of tombstoning (C4), billboarding (R6), bridging (IC1), spattering (all over), solder balls (bottom right), and insufficient fill (IC2). So how do we detect and correct these problems? Visual Inspection So how do we detect and correct these problems? Visual Inspection In the lowest volumes, usually by the person who did the assembly, the best way is to use your plain old eyeballs. A single glance isn’t nearly enough, though. It’s important to methodically look at and consciously think about each connection and whether it is good or not. Lots of good light makes the job easier, too. Microscope Inspection In the lowest volumes, usually by the person who did the assembly, the best way is to use your plain old eyeballs. A single glance isn’t nearly enough, though. It’s important to methodically look at and consciously think about each connection and whether it is good or not. Lots of good light makes the job easier, too. Microscope Inspection It can be straining on the eyes to look closely at every joint, and depending on available lighting conditions and the size of the components used, it may not even be possible. Sometimes it’s necessary to bring in a microscope. You can start with a loupe, a simple handheld lens usually used by jewelers, or the magnifying glass on your helping hands. These can have built in lights as well. Then there are USB microscopes that let you see the zoomed image on a big screen. Others are purely optical and make you stuff your face up close to the eyepiece. In Circuit Tests A flying probe test with top and bottom probes and programmable angles (http://acculogic.com/blog/production-testing-using-flying-probe-systems/) It can be straining on the eyes to look closely at every joint, and depending on available lighting conditions and the size of the components used, it may not even be possible. Sometimes it’s necessary to bring in a microscope. You can start with a loupe, a simple handheld lens usually used by jewelers, or the magnifying glass on your helping hands. These can have built in lights as well. Then there are USB microscopes that let you see the zoomed image on a big screen. Others are purely optical and make you stuff your face up close to the eyepiece. In Circuit Tests A flying probe test with top and bottom probes and programmable angles (http://acculogic.com/blog/production-testing-using-flying-probe-systems/) Move two probes to specific locations and measure the resistance or capacitance, and do this repeatedly, and you have a decent way of verifying the circuit. There are two variations on this. In-circuit tests use a test jig with a whole bunch of pogo pins (called “bed of nails”). The jig is pressed down onto the PCB, measurements are made from each of the pins, and it’s done. The downside to this method is the need for a new fixture when changing designs, but the upside is super-fast testing and the ability to do other operations, including programming. Move two probes to specific locations and measure the resistance or capacitance, and do this repeatedly, and you have a decent way of verifying the circuit. There are two variations on this. In-circuit tests use a test jig with a whole bunch of pogo pins (called “bed of nails”). The jig is pressed down onto the PCB, measurements are made from each of the pins, and it’s done. The downside to this method is the need for a new fixture when changing designs, but the upside is super-fast testing and the ability to do other operations, including programming. The other variation is flying-probe testing, in which the machines have a few probes on a gantry that can fly around a board at dizzying speed. There is no fixture required, so setting up this testing process is much quicker and more robust, but because the process is serial instead of parallel like the ICT method, it can take longer to test each PCB, making it more expensive (plus the machines are fancy and expensive). X-Rays and Saws X-Ray of a PCB with a lot of bridges between solder balls. The other variation is flying-probe testing, in which the machines have a few probes on a gantry that can fly around a board at dizzying speed. There is no fixture required, so setting up this testing process is much quicker and more robust, but because the process is serial instead of parallel like the ICT method, it can take longer to test each PCB, making it more expensive (plus the machines are fancy and expensive). X-Rays and Saws X-Ray of a PCB with a lot of bridges between solder balls. How do you know if your BGA chip was assembled properly? Zap it with some X-rays and look inside! Granted, this is not a method that’s easily available to the hobbyist, at least not without calling in a few favors, but it’s the only non-destructive way to inspect a PCB. How do you know if your BGA chip was assembled properly? Zap it with some X-rays and look inside! Granted, this is not a method that’s easily available to the hobbyist, at least not without calling in a few favors, but it’s the only non-destructive way to inspect a PCB.
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